Historical
IEC 60068-2-54 Ed. 2.0 b:2006
Environmental testing Part 2 54 Tests Test Ta Solderability testing of electronic components by the wetting balance method
IEC 60068 2 54 2006 outlines Test Ta solder bath wetting balance method applicable for any shape of component terminations to determine the solderability It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods For surface mounting devices SMD IEC 60068 2 69 should be applied if it is suitable This standard provides the standard procedures for solder alloys containing lead Pb and for lead free solder alloys This second edition cancels and replaces the first edition published in 1985 and constitutes a technical revision The major technical changes with regard to the previous edition concern the addition of lead free solder alloy see Clause 7 Materials reversal of force time curves to align with IEC 60068 2 69 see Figure 2 and Figure B 1 modification to the test requirement for progress of wetting see Clause 9
Content Provider
International Electrotechnical Commission [iec]
