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IPC T-50K-2013

     

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry acronyms.
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