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SEMI F47-0706 |
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Specification for Semiconductor Processing Equipment Voltage Sag Immunity |
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This standard was technically approved by the global Facilities Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June 2006 and on CD-ROM in July 2006. Originally published September 1999; Previously published February 2000. NOTICE: This document was completely rewritten in 2006. This document replaces SEMI F47-0200 and SEMI F42-0600. Semiconductor factories require high levels of power quality due to the sensitivity of equipment and process controls. Semiconductor processing equipment is especially vulnerable to voltage sags. This specification defines the voltage sag immunity required for semiconductor processing, metrology, and automated test equipment. This specification strikes a balance between voltage sag immunity and increased equipment cost. NOTE 1: The requirements and recommendations in this international specification were developed to satisfy semiconductor industry needs. While differing from other generic requirements, this industry-specific set of requirements and recommendations is not in conflict with known generic equipment regulations from other regions or generic equipment specifications from other organizations. NOTE 2: To minimize design effort and testing, this revision aligns SEMI F47 test methods with applicable IEC standards, while retaining the previous SEMI F47 test levels. It also incorporates knowledge gained in the first five years of experience with this specification. This specification sets minimum voltage sag immunity requirements for equipment used in the semiconductor industry. Immunity is specified in terms of voltage sag depth (in percent of nominal voltage remaining during the sag) and voltage sag duration (in cycles or seconds). This specification also sets procurement requirements, test methods, pass/fail criteria, and test report requirements. The primary focus of this specification is semiconductor processing equipment including but not limited to the following types: + Etch equipment (Dry & Wet) + Film deposition equipment (CVD & PVD) + Thermal equipment + Surface prep and clean equipment + Photolithography equipment (Scanner, Stepper & Tracks) + Ion Implant equipment + Metrology equipment + Automated test equipment + Chemical Mechanical Polishing/Planarization equipment The secondary focus of this specification is subsystems and components that are used in the construction of semiconductor processing equipment, including but not limited to: + Power supplies + Radio frequency generators and matching networks + Ultrasonic generators + Computers and communication systems + Robots and factory interfaces + AC Contactor coils and AC relay coils + Chillers and cryo pumps + Pumps and blowers + Adjustable speed drives This specification applies to semiconductor processing equipment to include the equipment mainframe and all subsystems whose electrical power is directly affected by the operation of the equipment’s EMO (emergency off) system. Grandfather Clause - Equipment, subsystems, and components that were tested or certified under the previous version of this specification, prior to the publication date of this specification, do not require re-testing or re-certification until hardware or software design changes that could affect voltage sag immunity are implemented. NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use. Referenced SEMI Standards SEMI E51 - Guide for Typical Facilities Services and Termination Matrix SEMI S2 - Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
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