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Semiconductor Fabrication Standards Semiconductor Fabrication Standards cover the production process of semiconductors. Given the importance of clean rooms, these standards address gas distribution in that context, as well as the use and quality of water. Additionally, IEC 62258 provides information about semiconductor die products. Other topics of importance are included as well, such as EM immunity, examination of semiconductors, and aerospace-specific requirements.

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  • Other Fabrication Standards

  • Avionics

    Avionics

    IEC/TR 62240-1 Ed. 1.0 en:2013

    Process management for avionics Electronic components capability in operation Part 1 Temperature uprating

    IEC/TS 62564-1 Ed. 3.0 en:2016

    Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors

    IEC/TS 62686-1 Ed. 2.0 en:2015

    Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

    SAE GEIASTD 0002-1A-2015 (SAE GEIASTD0002-1A-2015)

    Aerospace Qualified Electronic Component (AQEC) Requirements, Volume 1 - Integrated Circuits and Semiconductors (Stabilized: Mar 2015)


    Clean Room

    Clean Room

    ASTM E2734/E2734M-10

    Standard Specification for Dimensions of Knife-Edge Flanges


    Die Products

    Die Products

    IEC 62258-1 Ed. 2.0 b:2009

    Semiconductor die products - Part 1: Procurement and use

    IEC 62258-2 Ed. 2.0 b:2011

    Semiconductor die products - Part 2: Exchange data formats

    IEC/TR 62258-3 Ed. 2.0 b:2010

    "Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage "

    IEC/TR 62258-4 Ed. 2.0 b:2012

    Semiconductor die products - Part 4: Questionnaire for die users and suppliers

    IEC 62258-5 Ed. 1.0 b:2006

    Semiconductor die products - Part 5: Requirements for information concerning electrical simulation

    IEC 62258-6 Ed. 1.0 en:2006

    Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

    IEC/TR 62258-7 Ed. 1.0 en:2007

    Semiconductor die products - Part 7: XML schema for data exchange

    IEC/TR 62258-8 Ed. 1.0 en:2008

    Semiconductor die products - Part 8: EXPRESS model schema for data exchange


    EM Immunity

    EM Immunity

    CISPR 14-1 Ed. 6.0 b:2016

    Electromagnetic compatibility - Requirements for household appliances, electric tools and similar apparatus - Part 1: Emission

    IEC 62132-3 Ed. 1.0 b:2007

    "Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method"

    IEC 62132-4 Ed. 1.0 b:2006

    Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method


    Examination

    Examination

    ASTM E1161-09(2014)

    Standard Practice for Radiologic Examination of Semiconductors and Electronic Components

    ASTM E2387-05(2011)

    Standard Practice for Goniometric Optical Scatter Measurements

    ASTM E2698-10

    Standard Practice for Radiological Examination Using Digital Detector Arrays

    ISO 29301:2010

    Microbeam analysis - Analytical transmission electron microscopy - Methods for calibrating image magnification by using reference materials having periodic structures


    Gas Distribution

    Gas Distribution

    ASTM F1376-92(2012)

    Standard Guide for Metallurgical Analysis for Gas Distribution System Components

    ASTM F1394-92(2012)

    Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves

    ASTM F1396-93(2012)

    Standard Test Method for Determination of Oxygen Contribution by Gas Distribution System Components

    ASTM F1397-93(2012)

    Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components

    ASTM F1398-93(2012)

    Standard Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components

    CGA V-7-2015

    Standard Method of Determining Cylinder Valve Outlet Connections for Industrial Gas Mixtures

    ICC IFC-2012

    2012 International Fire Code


    Lead Bonding

    Lead Bonding

    ASTM F487-13

    Standard Specification for Fine Aluminum–1???% Silicon Wire for Semiconductor Lead-Bonding


    Water

    Water

    ASTM D5127-13

    Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries

    ASTM D5544-16

    Standard Test Method for On-Line Measurement of Residue After Evaporation of High-Purity Water


    Other Fabrication Standards

    Other Fabrication Standards

    NFPA 318-2012

    Standard for the Protection of Semiconductor Fabrication Facilities, 2012 Edition

    IEC 60269-4 Ed. 5.1 b:2012

    Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

    ASTM F1709-97(2016)

    Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

    IEC 60204-33 Ed. 1.0 b:2009

    Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment

    IEC 61922 Ed. 1.0 b:2002

    High-frequency induction heating installations - Test methods for the determination of power output of the generator

    IPC J-STD-026-1999

    Semiconductor Design Standard for Flip Chip Applications