IEC 60191-4 Ed. 2.0 b:1999

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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.

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International Electrotechnical Commission [iec]

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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package

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IEC 60191-4 Ed. 2.0 b:1999

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device package

Are the documents at the ANSI Webstore in electronic Adobe Acrobat PDF format only?

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