Most recent
IEC 62374-1 Ed. 1.0 b:2010
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
"IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices."
Content Provider
International Electrotechnical Commission [iec]