Historical
IPC 4101D-2014
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using keywords. These keywords allow users to find similar materials that may have specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revisionÆs 11 new specification sheets reflect the expanded offerings of current commercially available laminates and prepregs. These specification sheets add laminate and prepreg materials that have improved or additional properties, including one or more of the following: low halogen content, leadfree applications, high thermal performance or high speed/high frequency performance.
Association Connecting Electronics Industries [ipc]