Historical
IPC T-50J-2011
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Terms and Definitions for Interconnecting and Packaging Electronic Circuits This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components and microvia technology. Also includes commonly used industry acronyms. Included in collections C-102, C-103, C-105, C-106, C-107, C-108 and C-1000.
Content Provider
Association Connecting Electronics Industries [ipc]
