Most recent
IPC/JEDEC 9704A-2012
Printed Circuit Assembly Board Strain Gage Test Guidelines
Describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. Also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement, and has been updated to address lead-free assembly technology.
Content Provider
Association Connecting Electronics Industries [ipc]
