Historical
IPC J-STD-003B-2007
Solderability Tests for Printed Boards
IPC/EIA J-STD-003A provides industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes. This revision includes a significant change in the type of flux required to be used for solderability testing. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance. Produced by IPC and EIA. Supersedes J-STD-003. 26 pages. Released February 2003.
CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]