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IPC-7091

Design and Assembly Process Implementation of 3D Components

The IPC-7091 intends to provide useful and practical information to those who are designing,developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elementsùsome homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the componentsÆ substrate structure.

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Association Connecting Electronics Industries [IPC]


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As the voice of the U.S. standards and conformity assessment system, the American National Standards Institute (ANSI) empowers its members and constituents to strengthen the U.S. marketplace position in the global economy while helping to assure the safety and health of consumers and the protection of the environment.

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