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IPC CM-770E-2004

Component Mounting Guidelines for Printed Boards

This document provides guidelines in the preparation and attachment of components for printed board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines, including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning and coating processes.

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Association Connecting Electronics Industries [IPC]


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As the voice of the U.S. standards and conformity assessment system, the American National Standards Institute (ANSI) empowers its members and constituents to strengthen the U.S. marketplace position in the global economy while helping to assure the safety and health of consumers and the protection of the environment.

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