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IPC J-STD-004B+Amd1-2011

Requirements for Soldering Fluxes with Amendment 1

Classifies and characterizes tin-lead and leadfree soldering flux materials for use in electronic metallurgical interconnections for printed board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnections.


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Association Connecting Electronics Industries [IPC]


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