Historical
IPC J-STD-004B+Amd1-2011
Requirements for Soldering Fluxes with Amendment 1
Classifies and characterizes tin-lead and leadfree soldering flux materials for use in electronic metallurgical interconnections for printed board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnections.
Content Provider
Association Connecting Electronics Industries [ipc]
