High Reliability Electronics Standards
Standards for high reliability electronics are a constellation of documents from different standards developing organizations, each contributing in their field of expertise. Here, the Government Electronics & Information Technology Association (GEIA) and TechAmerica, the organization GEIA merged into, have published standards dealing with the electronics themselves. The American Society for Testing and Materials (ASTM), contributed standards detailing the testing of electronics for counterfeiting, alteration, and so forth. ISO and IEC, both wide ranging international standards organizations, published standards addressing interoperability and universal models for reliability prediction. In essence, as reliability in electronics is such an important issue, and touches upon so many different aspects, everyone contributes their share of knowledge.
IEC 61709 Ed. 3.0 b:2017
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319. Keywords: failure rate data, reliability prediction of electric components
ASTM F1448-16
Standard Guide for Selection of Security Technology for Protection Against Counterfeiting, Alteration, Diversion, Duplication, Simulation, and Substitution (CADDSS) of Products or Documents
1.1 This general guide is intended to assist the user of the guide in selecting anti-CADDSS technologies to protect their product from CADDSS. 1.2 This guide does not address or evaluate specific anti-CADDSS technologies, but rather suggests a path that assists in the objective evaluation of features of anti-CADDSS technologies available protection of their product from CADDSS. 1.3 This guide provides a procedure to accomplish the proper selection of a security system. Specific technologies are not addressed, nor are any technologies recommended. There are many security systems available in the public marketplace today. Each has limitations and must be carefully measured against the parameters presented in this guide. Once this careful analysis is done, the user will be in a knowledgeable position to select a security system to meet his needs.
ISO/IEC 15149:2011
Information technology - Telecommunications and information exchange between systems - Magnetic field area network (MFAN)
ISO/IEC 15149:2011 specifies the physical layer and media access control layer protocols of a wireless network over a magnetic field in a low frequency band (~300 kHz), for wireless communication in harsh environments (i.e. around metal, underwater, underground, etc.). The physical layer protocol is designed for the following scope: low carrier frequency for large magnetic field area and reliable communication in harsh environments; simple and robust modulation for a low implementation cost and error performance; variable coding and bandwidth for a link adaptation. The media access control layer protocol is designed for the following scope: simple and efficient network topology for low power consumption; variable superframe structure for compact and efficient data transmission; dynamic address assignment for small packet size and efficient address management. ISO/IEC 15149:2011 supports several kbps data transmission in a wireless network within a distance of several metres. It can be applied to various services such as the following areas: in the environmental industry, to manage pollution levels in soil and water using wireless underground or underwater sensors; in the construction industry, to monitor the integrity of buildings and bridges using wireless, inner-corrosion sensors; in the consumer-electronics industry, to detect food spoilage in wet, airtight storage areas and to transfer the sensing data from the inside to the outside; in the agricultural industry, to manage the moisture level as well as mineral status in soil using buried wireless sensors; in the transportation industry, to manage road conditions and traffic information using wireless underground sensors.
IPC J-STD-001F+Amd1-2016
Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this documentÆs recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610.
