Customer Service:
Mon - Fri: 8:30 am - 6 pm EST

Die Products

Semiconductor Fabrication Standards cover the production process of semiconductors. Given the importance of clean rooms, these standards address gas distribution in that context, as well as the use and quality of water. Additionally, IEC 62258 provides information about semiconductor die products. Other topics of importance are included as well, such as EM immunity, examination of semiconductors, and aerospace-specific requirements.

IEC 62258-1 Ed. 2.0 b:2009

Semiconductor die products - Part 1: Procurement and use

"IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8). "

Available for Subscriptions

IEC 62258-2 Ed. 2.0 b:2011

Semiconductor die products - Part 2: Exchange data formats

"IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition. "

Available for Subscriptions

IEC/TR 62258-3 Ed. 2.0 b:2010

"Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage "

"IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly. This edition includes the following significant technical changes with respect to the previous edition. 1. Special requirements have been added throughout the document for optical die, where applicable. For example see 4.3 paragraph 4 and 10.1.3 paragraph 3. 2. The following new subclauses have been added: - 4.4.6 ESD Guidelines - 5.1 Wafer thinning 3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including: - 5.2.2 Wafer scribing - 5.2.3 Laser cutting - 5.2.4 Dice before grind (DBG) 4. Subclause 5.3.7 (previous edition Subclause 5.2.7) has been changed to include optical and microwave die. 5. In Subclause 6.3, the Subclause 6.3.2 (Specialised wafer tubs) has been added to include wafer taubs specially handle and ship wafers that have not been singulated. 6. Two new Subclauses have been to Clause 6: - 6.9 Handling and packing of thinned die or wafers - 6.10 Packing materials and their reuse 7. A new subclause has been added to Subclause 9.6: - 9.6.3 Use of packing material having sacrificial properties 8. Annex A (Planning checklist) has been updated throughout. 9. In Annex B (Material specifications) a new Subclause has been added: - B.5 Adhesive gel tray material specifications. "

Available for Subscriptions

IEC/TR 62258-4 Ed. 2.0 b:2012

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein. This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.

Available for Subscriptions

IEC 62258-5 Ed. 1.0 b:2006

Semiconductor die products - Part 5: Requirements for information concerning electrical simulation

IEC 62258-5:2006 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. This publication is to be read in conjunction with IEC 62258-1:2009 and IEC 62258-2:2011 .

Available for Subscriptions

IEC 62258-6 Ed. 1.0 en:2006

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

Available for Subscriptions

IEC/TR 62258-7 Ed. 1.0 en:2007

Semiconductor die products - Part 7: XML schema for data exchange

"This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4."

Available for Subscriptions

IEC/TR 62258-8 Ed. 1.0 en:2008

Semiconductor die products - Part 8: EXPRESS model schema for data exchange

"IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4. "

Available for Subscriptions
ANSI Logo

As the voice of the U.S. standards and conformity assessment system, the American National Standards Institute (ANSI) empowers its members and constituents to strengthen the U.S. marketplace position in the global economy while helping to assure the safety and health of consumers and the protection of the environment.

Useful Links
CUSTOMER SERVICE
NEW YORK OFFICE
ANSI HEADQUARTERS
2024 © American National Standards Institute (ANSI) All Rights Reserved.