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IPC: Association Connecting Electronics Industries

IPC, the Association Connecting Electronics Industries, is a nonprofit organization that develops and publishes standards guiding the assembly and production of electronic equipment. Headquartered near Chicago, United States, IPC standards are the most widely used acceptability standards in the electronics industry. IPC standards are used by over 3,600 certified trainers and testers. In addition to individual members, IPC has offices and representatives throughout the world to gather more input for its standards and to further spread them.

Below are IPC's best-selling standards. To find additional standards, please use the search bar above.

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IPC/WHMA A-620C-2017

Requirements and Acceptance for Cable and Wire Harness Assemblies

This is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620C was developed by IPC and the Wire Harness Manufacturers Association (WHMA).

IPC 9592B-2012

Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. This specification sets the requirements for design, qualification testing, conformance testing and manufacturing quality/reliability processes, but does not include the functional requirements of the specific equipment. This revision includes more definitive preconditioning tests for surface mount PCD modules used for category 2 devices (dc to dc converters). Revision A also expands the coverage of moisture sensitivity levels (MSLs) for PCDs and addresses corrosion of PCDs in various commercial, manufacturing and uncontrolled external environments. It also significantly increases the coverage of the HALT (highly accelerated life testing) description and application to PCDs.

IPC 2221B-2012

Generic Standard on Printed Board Design

This standard establishes the general requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. These requirements establish design principles and recommendations that shall be used to produce detailed designs intended to mount and attach passive and active components.


Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies. In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.

IPC 6012D-2015

Qualification and Performance Specification for Rigid Printed Boards

This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. For use with IPC-6011.

IPC 7711/7721C-2017

Rework, Modification and Repair of Electronic Assemblies

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures

IPC A-610F-2014

Acceptability of Electronic Assemblies

This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this documentÆs recommendations and requirements, one may use this document in conjunction with IPCHDBK- 001, IPC-AJ-820 and IPC J-STD-001.

IPC A-610G-2017

Acceptability of Electronic Assemblies

IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed in synergy with J-STD-001, and for the first time with this revision, IPC/WHMA-A-620.

IPC J-STD-001G-2017

Requirements for Soldered Electrical and Electronic Assemblies

IPC J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. IPC J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements.


As the voice of the U.S. standards and conformity assessment system, the American National Standards Institute (ANSI) empowers its members and constituents to strengthen the U.S. marketplace position in the global economy while helping to assure the safety and health of consumers and the protection of the environment.