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IPC: Association Connecting Electronics Industries

IPC, the Association Connecting Electronics Industries, is a nonprofit organization that develops and publishes standards guiding the assembly and production of electronic equipment. Headquartered near Chicago, United States, IPC standards are the most widely used acceptability standards in the electronics industry. IPC standards are used by over 3,600 certified trainers and testers. In addition to individual members, IPC has offices and representatives throughout the world to gather more input for its standards and to further spread them.

Below are IPC's best-selling standards. To find additional standards, please use the search bar above.

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IPC A-610H-2020

IPC-A-610H: Acceptability of Electronic Assemblies

IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed in synergy with J-STD-001 and IPC/WHMA-A-620.


IPC/WHMA A-620D-2020

Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.  IPC/WHMA-A-620D was developed by IPC and the Wire Harness Manufacturers Association (WHMA) (An affiliate of IPC).


IPC 7351B-2010

Generic Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately. The tool also allows for modification of dimensional attributes of IPC approved land patterns. This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density. Revision B includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.


IPC 9592B-2012

Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. This specification sets the requirements for design, qualification testing, conformance testing and manufacturing quality/reliability processes, but does not include the functional requirements of the specific equipment. This revision includes more definitive preconditioning tests for surface mount PCD modules used for category 2 devices (dc to dc converters). Revision A also expands the coverage of moisture sensitivity levels (MSLs) for PCDs and addresses corrosion of PCDs in various commercial, manufacturing and uncontrolled external environments. It also significantly increases the coverage of the HALT (highly accelerated life testing) description and application to PCDs.


IPC J-STD-002E-2017

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user. The IPC-J-STD-002E standard was developed by the following three organizations: ECIA, IPC and JEDEC.


IPC 6012E-2020

Qualification and Performance Specification for Rigid Printed Boards

IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.


IPC 2152-2009

Standard for Determining Current Carrying Capacity in Printed Board Design

The sole industry standard for determining appropriate internal and external conductor sizes on printed boards as a function of the current carrying capacity required and the acceptable conductor temperature rise. This document provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between current, conductor size and temperature.


IPC J-STD-001G-2017

Requirements for Soldered Electrical and Electronic Assemblies

IPC J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. IPC J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements.


IPC J-STD-006C+AMD1-2017

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications + Amendment 1

This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004, Requirements for Soldering Fluxes; IPC/EIA J-STD-005, Requirements for Soldering Pastes; IPC J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the J-STD-006C standard.


IPC A-600K-2020

Acceptability of Printed Boards

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision K provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap plating, via fill and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012D and IPC-6013C. Supersedes IPC-A-600J.


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As the voice of the U.S. standards and conformity assessment system, the American National Standards Institute (ANSI) empowers its members and constituents to strengthen the U.S. marketplace position in the global economy while helping to assure the safety and health of consumers and the protection of the environment.

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