Customer Service:
Mon - Fri: 8:30 am - 6 pm EST

Reliability

Semiconductor Reliability Standards include tests for electrostatic discharge (ESD), radiation-hardness, longevity and life-span estimations through accelerated testing, as well as other varied tests for semiconductors and semiconductor devices.

IEC 62374 Ed. 1.0 b:2007

Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films

Provides a test method of Time Dependent Dielectric Breakdown (TDDB) for gate dielectric films on semiconductor devices and a product lifetime estimation method of TDDB failure

Available for Subscriptions

IEC 62374-1 Ed. 1.0 b:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

"IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices."

Available for Subscriptions

SAE SSB 1/001-2014 (SAE SSB1/001-2014)

Qualification and Reliability Monitors

This document is an annex to EIA Engineering Bulletin, SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugges Applications (the latest revision). The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.

Available for Subscriptions

SAE SSB 1/003A-2014 (SAE SSB1/003A-2014)

Acceleration Factors

This document is an annex to EIA Engineering Bulletin SAB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provided reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.

Available for Subscriptions
ANSI Logo

As the voice of the U.S. standards and conformity assessment system, the American National Standards Institute (ANSI) empowers its members and constituents to strengthen the U.S. marketplace position in the global economy while helping to assure the safety and health of consumers and the protection of the environment.

Useful Links
CUSTOMER SERVICE
NEW YORK OFFICE
ANSI HEADQUARTERS
2024 © American National Standards Institute (ANSI) All Rights Reserved.