Historical
IPC 1601-2010
Printed Board Handling and Storage Guidelines
The industryÆs sole guideline on the handling, packaging and storage of printed boards. IPC-1601 provides users with guidelines to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability.
Content Provider
Association Connecting Electronics Industries [ipc]
