IEC 60749-3 Ed. 1.0 b:2002

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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

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Historical

IEC 60749-3 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

Are the documents at the ANSI Webstore in electronic Adobe Acrobat PDF format only?

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