Historical

ASTM D5824-98(2011)

Standard Test Method for Determining Resistance to Delamination of Adhesive Bonds in Overlay-Wood Core Laminates Exposed to Heat and Water


1.1 This test method provides a procedure to determine the quality of bond between an overlay and a wood core in an adhesively bonded laminate. The quality of bond is determined by measuring the resistance to delamination of the adhesively bonded laminate when tested under specific conditions of preparation, conditioning, and testing. Such products include, but are not limited to, window and door components, such as stiles and rails, and other overlaid panels. Typical wood-based cores are finger-jointed lumber, particleboard, oriented strand board, and hardboard. Typical overlays would be veneer, high-pressure laminate, high-density polyethylene, and fiberglass-reinforced plastic.

1.2 Adhesive bond performance as measured by resistance to delamination in this test method is suitable for use in adhesive product development, manufacturing quality control, and monitoring bonding processes.

1.3 This test method does not provide guidance for determining bond line performance for plywood products.

1.4 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


CONTENT PROVIDER
ASTM International [astm]

Others Also Bought
Standard Test Method for Heat and Moisture Resistance of Wood-Adhesive Joints
Standard Specification for Adhesives for Structural Laminated Wood Products for Use Under Exterior (Wet Use) Exposure ...
Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds
Document History
Included in Packages
This standard is not included in any packages.
Amendments & Corrections
We have no amendments or corrections for this standard.