Historical

IPC 4553-2005

Specification for Immersion Silver Plating for Printed Circuit Boards

This specification sets the requirements for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. This specification is intended to set requirements for IAg deposit thickness based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

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Amendments & Corrections
We have no amendments or corrections for this standard.