Most recent

IPC/JEDEC 9704A-2012

Printed Circuit Assembly Board Strain Gage Test Guidelines

Describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. Also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement, and has been updated to address lead-free assembly technology.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Others Also Bought
Rework, Modification and Repair of Electronic Assemblies - Redline
Qualification and Performance Specification for Rigid Printed Boards
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
Included in Packages
This standard is not included in any packages.
Document History
Amendments & Corrections
We have no amendments or corrections for this standard.