Historical
IPC/JEDEC J-STD-609A-2010
IPC/JEDEC Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
Provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: 1) assemblies that are assembled with lead-containing or lead-free solder; 2) components that have lead-containing or lead-free second level interconnect terminal finishes and materials; 3) the maximum component temperature not to be exceeded during assembly or rework processing; 4) base materials used in PCB construction, including PCBs that use halogen-free resin; 5) the surface finish of PCBs; and 6) the conformal coating on PCBAs. New to this revision are additional codes for the more precise specification of certain lead-free solders.
CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]