IPC J-STD-026-1999

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Semiconductor Design Standard for Flip Chip Applications

This standard addresses semiconductor chip design. It is intended for applications utilizing standard substrates, materials, assembly, and test methods as well as established semiconductor fabrication and bumping processes.

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Association Connecting Electronics Industries [ipc]

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Semiconductor Design Standard for Flip Chip Applications

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IPC J-STD-026-1999

Semiconductor Design Standard for Flip Chip Applications

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