US and international standards for electronic components, capacitors, transducers, surge protectors, LEDs, and resistors find wide application in consumer products, vehicles, medical devices, sensors and controls for industrial use and more. A representative selection of nearly one hundred standards published in recent years covering electronic components are provided here. For even more electronic component standards search by keyword in the field above or browse the offerings of the International Electrotechnical Commission (IEC) and the Institute of Electrical and Electronics Engineers (IEEE), two standard developing organizations focused on electronics and their design, manufacture, testing, use, and end-of-life procedures.
IEC 61188-7:2017(E) establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners. This edition includes the following significant technical changes with respect to the previous edition: a) Figure 1 has been corrected; b) the term rectangle has generally been replaced by polygon ; c) level B has been indicated as preferred level for new libraries.
IEC TS 62686-1:2020 is available as IEC TS 62686-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC TS 62686-1:2020 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition: - update related to obsolescence of STACK Specification S/0001 revision 14 notice 3; - addition of alternative automotive methods of compliance and revision of Annex B initially related to cross-reference to STACK Specification S/0001; - addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.
IEC TS 62564-1:2016(E) defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)". This new edition includes the following significant technical changes with respect to the previous edition: - refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications; - adds information regarding components' life expectancy.
IEC 60286-1:2017(E) applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: a) a complete revision of the structure (detailed in Annex A) and reworked layout.
IEC 60286-2:2022 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape components with unidirectional leads. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant technical changes with respect to the previous edition: a) complete revision of structure; b) consolidation of essential parameters and requirements in Clause 4.
IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: addition terms and definitions. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre; addition of drive hole to the reel (optional); revision of reel hole diameter tolerances; revision of 72 mm tape size carrier tape width dimension tolerances; addition of Annex B (informative); addition of component size 0201M.
IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.
IEC 60286-5:2003+A1:2009 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This consolidated version consists of the second edition (2003) and its amendment 1 (2009). Therefore, no need to order amendment in addition to this publication.
is applicable to bulk case packaging capable of containing surface mounting components. The bulk case is designed for transport and storage of components and the supply of components directly or by an appropriate feeder to the placement machine. The bulk case is attached to the automatic handling machine by means of a coupling interface
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
IEC 60068-2-83:2025 is available as an IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068 2 58 and IEC 60068 2 69. IEC 60068 2 58 specifies visual evaluation using solder bath and reflow method, IEC 60068 2 69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068 2 20:2021.
This SAE Aerospace Recommended Practice (ARP) is a tool that organizations may use to evaluate a non-authorized supplier’s processes for the prevention, detection, containment, adjudication, and reporting of suspect counterfeit and counterfeit EEE parts. See 3.1.1 and 3.1.2 , which reference the use of AS6081 when performing pre-visit self-assessment and on-site assessment of non-authorized suppliers. This ARP is applicable for all organizations that procure EEE parts from suppliers other than authorized sources (e.g., independent distributors).