Historical
ASTM F458-13
Standard Practice for Nondestructive Pull Testing of Wire Bonds
1.1 This practice covers nondestructive testing of individual wire bonds made by either ultrasonic, thermal compression or thermosonic techniques. The test is intended to reveal (by breaking) nonacceptable wire bonds but is designed to avoid damage to acceptable wire bonds.
1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-??m)) wire such as the type used in integrated circuits and hybrid microcircuits, system in package, and so forth.
1.3 This practice can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling to be placed under the wire.
1.4 While the procedure is applicable to wire of any composition and metallurgical state, criteria are given only for gold and aluminum wire.
ASTM International [astm]