Historical

IEC 60749-20 Ed. 1.0 b Cor.1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Modification of the validity date: now put at 2007.

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International Electrotechnical Commission [iec]

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