Historical
IEC 60749-21 Ed. 1.0 b:2004
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
"Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application."
CONTENT PROVIDER
International Electrotechnical Commission [iec]
International Electrotechnical Commission [iec]