IEC 60749-22 Ed. 1.0 b:2002

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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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