Historical
IEC 60749-37 Ed. 1.0 b:2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an acceleromete
"Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test."
Content Provider
International Electrotechnical Commission [iec]
