Most recent

IEC 61188-6-1 Ed. 1.0 b:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

CONTENT PROVIDER
International Electrotechnical Commission [iec]

Others Also Bought
Generic Standard on Printed Board Design
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Generic Requirements for Surface Mount Design and Land Pattern Standard
Included in Packages
This standard is not included in any packages.
Document History
We have no document history for this standard.
Amendments & Corrections
We have no amendments or corrections for this standard.