Historical
IEC 61191-3 Ed. 1.0 b:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
CONTENT PROVIDER
International Electrotechnical Commission [iec]
International Electrotechnical Commission [iec]
