Historical
IPC 2223A-2004
Sectional Design Standard for Flexible Printed Boards
This standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or nonreinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid.
CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]