Historical

IPC 2226-2003

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

This standard provides recommendations for signal, power,ground and mixed distribution layers, dielectric separation,via formation and metallization requirements and otherdesign features that are necessary for HDI-advanced ICinterconnection substrates in printed board design.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

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Amendments & Corrections
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