Historical
IPC 2226-2003
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
This standard provides recommendations for signal, power,ground and mixed distribution layers, dielectric separation,via formation and metallization requirements and otherdesign features that are necessary for HDI-advanced ICinterconnection substrates in printed board design.
- ADD TO ALERT |
- PDF |
- DRM |
Association Connecting Electronics Industries [ipc]