Historical
IPC 4103A-2011
Specification for Base Materials for High Speed/High Frequency Applications with Errata
This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to providing updated testing parameters, inspection lot requirements and revised visual acceptance criteria, this revision incorporates a new specification sheet format for new materials that provides both mandatory (e.g., Df and Dk) requirements and “loose” requirements (e.g., thermal conductivity and moisture absorption) that can be certified to or called out on fabrication drawings. This new classification format allows for a reduced number of material specification sheets.
Association Connecting Electronics Industries [ipc]