Most recent

IPC 4103B-2017

Specification for Base Materials for High Speen/High Frequency Applications

IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition of thermal conductivity of laminates and bonding material, IPC-4103B also allows the use of low permittivity (dielectric constant) glass reinforcements for laminates and bonding materials, thus improving both the permittivity and loss tangent properties of the materials conforming to this specification.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Others Also Bought
Specification for Base Materials for Rigid and Multilayer Printed Boards
Generic Standard on Printed Board Design
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Included in Packages
This standard is not included in any packages.
Document History
Amendments & Corrections
We have no amendments or corrections for this standard.