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IPC 4555-2022

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555

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Association Connecting Electronics Industries [ipc]

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