Most recent
IPC 4555-2022
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555
- ADD TO ALERT |
- PDF |
- DRM |
Association Connecting Electronics Industries [ipc]