Historical

IPC T-50F-1996

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

The IPC Solder Products Value Council White Paper, "Round Robin Testing and Analysis, Lead Free Alloys - Tin, Silver and Cooper" (IPC-SPVC-WP-006), summarizes a round robin test program on the assembly properties of three lead free solder alloys. Melt characterization, wetting balance responses and solder spread tests were performed by IPC-SPVC members on the three tin-silver-cooper alloys in the following percentages respectively: 96.5/ 3.0/ 0.5; 95.5/ 3.8/ 0.7; and 95.5/ 4.0/ 0.5. The 19-page white paper includes examples of statistical analysis, data analysis of the tests, data tables of testing participants and a reproduction of IPC test methods used. Released August 2003.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Others Also Bought
Standard Practice for Fabrication and Closure of Triple-Wall Corrugated Fiberboard Containers
Included in Packages
This standard is not included in any packages.
Document History
Revised By:
Amendments & Corrections
We have no amendments or corrections for this standard.