Historical
IPC A-600H-2010
Acceptability of Printed Boards with Errata
The definitive illustrated guide to printed board acceptability! This four-color document includes photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors and engineers have the most current industry consensus information. With more than 90 new or updated photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B.
Content Provider
Association Connecting Electronics Industries [ipc]
