Historical

IPC 6018C-2016

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Included in Packages
This standard is not included in any packages.
Document History
Revises:
Revised By:
Amendments & Corrections
Amended By: