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IPC 7091A-2023
Design and Assembly Process Implementation of 3D Components
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the e ects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.
Content Provider
Association Connecting Electronics Industries [ipc]
