Historical

IPC 7530A-2017

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

This document provides guidelines for the construction of appropriate profiling test vehicles and various techniques and methodologies for temperature profiling.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Others Also Bought
Printed Board Handling and Storage Guidelines
Rework, Modification and Repair of Electronic Assemblies - Redline
Requirements for Solder Paste Printing
Included in Packages
This standard is not included in any packages.
Document History
Revises:
Revised By:
Amendments & Corrections
We have no amendments or corrections for this standard.