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IPC 7912A-2004

End-Item DPMO for Printed Circuit Board Assemblies

Intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices: Defects Per Million Opportunities Index (DPMO Index), Component DPMO, Placement DPMO, Termination DPMO, Overall Manufacturing Index (OMI). Both DPMO and OMI imply a measurement taken on completed product.

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Association Connecting Electronics Industries [ipc]

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