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IPC 9701B-2022

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

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