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IPC 9850-2002
Surface Mount Placement Equipment Characterization - Kit
This standard has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment characterization parameters. It establishes the procedures to characterize and document machine placement capability of surface mount assembly equipment while maintaining a placement accuracy to placement speed relationship. Kit includes one printed copy of the standard and a CD with the support spreadsheet, forms and the drawing files (Gerber format) necessary to make the test materials. (This CD is an exception to IPC's standard single user license and the material may be printed from the CD.)˜˜60 Pages. Released July 2002.
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Association Connecting Electronics Industries [ipc]