Most recent
IPC CM-770E-2004
Component Mounting Guidelines for Printed Boards
This document provides guidelines in the preparation and attachment of components for printed board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines, including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning and coating processes.
Content Provider
Association Connecting Electronics Industries [ipc]
