Historical

IPC/JEDEC 9704-CN-2005

Printed Wiring Board Strain Gage Test Guideline (Chinese Version)

This document describes specific guidelines for strain gage testing for Printed Wiring Board (PWB) assemblies in the board manufacturing process including, assembly, test, system integration and board shipping.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Included in Packages
This standard is not included in any packages.
Document History
Amendments & Corrections
We have no amendments or corrections for this standard.