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IPC/JEDEC 9707-2011
Spherical Bend Test Method for Characterization of Board Level Interconnects
This standard on spherical transient bend testing characterizes the maximum allowable strain that a surface mount component’s board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates attached to printed boards using conventional solder reflow technologies.
Association Connecting Electronics Industries [ipc]
