Historical
IPC/JEDEC J-STD-020D-2007
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices.
CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]